Compatible Systems RISC 2800i Manual do Utilizador descarregar pdf (Página 33)

MPC7448 RISC Microprocessor Hardware Specifications, Rev. 4

Freescale Semiconductor 33

Package Description

8.5 Package Parameters for the MPC7448, 360 HCTE

RoHS-Compliant BGA

The package parameters are as provided in the following list. The package type is 25 × 25 mm, 360-lead

high coefficient of thermal expansion ceramic ball grid array (HCTE) with RoHS-compliant lead-free

spheres.

Package outline 25 × 25 mm

Interconnects 360 (19 × 19 ball array – 1)

Pitch 1.27 mm (50 mil)

Minimum module height 1.92 mm

Maximum module height 2.40 mm

Ball diameter 0.75 mm (30 mil)

Coefficient of thermal expansion12.3 ppm/°C

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Compatible Systems RISC 2800i Manual do Utilizador Página 33